Please use this identifier to cite or link to this item: https://doi.org/10.1109/APS.2005.1551370
Title: Transfer functions of on-chip global interconnects based on distributed RLCG interconnects model
Authors: Kang, K.
Yin, W.-Y. 
Li, L.-W. 
Issue Date: 2005
Source: Kang, K.,Yin, W.-Y.,Li, L.-W. (2005). Transfer functions of on-chip global interconnects based on distributed RLCG interconnects model. IEEE Antennas and Propagation Society, AP-S International Symposium (Digest) 1 A : 524-527. ScholarBank@NUS Repository. https://doi.org/10.1109/APS.2005.1551370
Abstract: Novel transfer functions For on-chip global interconnects are rigorously derived based cm distributed resistance, inductance, capacitance and conductance (RLCG) transmission line model with typical boundary conditions. The new transfer function of interconnect reveals that the distributed conductance of interconnects has a severe effect on the performance of interconnect. The peak value of voltage will decrease about 50% in the case of g = 0.33S/m , compared with the ideal lossless case of g = 0 for the finite length interconnect with an open circuit termination and an arbitrary source impedance. The crosstalk between coupled interconnects is also examined and demonstrated numerically © 2005 IEEE.
Source Title: IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
URI: http://scholarbank.nus.edu.sg/handle/10635/72073
ISBN: 0780388836
ISSN: 15223965
DOI: 10.1109/APS.2005.1551370
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