Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/72049
Title: Towards an intelligent in-line temperature measurement system for semiconductor manufacturing
Authors: Tan, W.W. 
Zhang, J.
Loh, A.P. 
Keywords: In-situ temperature measurement
Out-of-contact fault
Post-exposure bake
Issue Date: 2001
Citation: Tan, W.W.,Zhang, J.,Loh, A.P. (2001). Towards an intelligent in-line temperature measurement system for semiconductor manufacturing. Conference Record - IEEE Instrumentation and Measurement Technology Conference 1 : 374-379. ScholarBank@NUS Repository.
Abstract: Photolithography is a major process in the semiconductor manufacturing industry. As the absolute temperature and temperature uniformity of the silicon wafer are important parameters for critical dimension control, special temperature considerations are needed during the various steps in the lithography sequence. The desire to print smaller features on larger substrates has necessitated more stringent wafer temperature control. It is becoming increasingly difficult to meet the tighter specifications using the current practices because wafer temperature is usually not measured in-line. Consequently, there are interest in developing in-situ wafer temperature metrology. This paper describes an intelligent in-line temperature acquisition system for continuously monitoring the wafer's spatial temperature distribution as well as the conditions of the sensing elements. Experimental results that demonstrate the feasibility of utilising the self-heating test to detect out-of-contact faults are presented.
Source Title: Conference Record - IEEE Instrumentation and Measurement Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/72049
Appears in Collections:Staff Publications

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