Please use this identifier to cite or link to this item: https://doi.org/10.1116/1.3117354
Title: Integrated bake/chill system for across-wafer temperature uniformity control in photoresist processing
Authors: Chua, H.T.
Tay, A. 
Wang, Y.
Issue Date: 2009
Citation: Chua, H.T., Tay, A., Wang, Y. (2009). Integrated bake/chill system for across-wafer temperature uniformity control in photoresist processing. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 (3) : 1211-1214. ScholarBank@NUS Repository. https://doi.org/10.1116/1.3117354
Abstract: An integrated bake/chill thermal processing module is developed and experimentally evaluated to achieve spatial temperature uniformity of a silicon wafer throughout the entire processing temperature cycle of ramp, hold, and quench in lithography. The module uses a set of thermoelectric devices which are used to provide distributed heating and cooling to the substrate for uniformity and transient temperature control. The experimental results demonstrate that the wafer spatial temperature uniformity is within ±0.3 and ±0.1 °C during transient and steady-state thermal processing, respectively. © 2009 American Vacuum Society.
Source Title: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
URI: http://scholarbank.nus.edu.sg/handle/10635/70618
ISSN: 10711023
DOI: 10.1116/1.3117354
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