Please use this identifier to cite or link to this item: https://doi.org/10.1109/APEC.2011.5744626
Title: Improved comprehensive thermal model for power electronics building block applications
Authors: Wang, H.
Khambadkone, A.M. 
Erik, B.K. 
Keywords: Finite Element Method (FEM)
short circuit
Thermal model
Issue Date: 2011
Source: Wang, H.,Khambadkone, A.M.,Erik, B.K. (2011). Improved comprehensive thermal model for power electronics building block applications. Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC : 390-395. ScholarBank@NUS Repository. https://doi.org/10.1109/APEC.2011.5744626
Abstract: Power electronics devices play a key role in utilizing energy efficiently. When the power demand is highly dynamic and variable, the key requirement is to transfer power to the load with the most appropriate voltage, current, phase and frequency so as to achieve the most efficient conversion of power under all load conditions. IGBT behavior under short circuit and overload turn off condition is thus quite important. In this paper, an improved and comprehensive thermal model for power electronics building block (PEBB) is presented, which provides a higher degree of predictability of temperature, in not only steady state, especially at high current conditions but also under different short circuit failure modes. © 2011 IEEE.
Source Title: Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
URI: http://scholarbank.nus.edu.sg/handle/10635/70550
ISBN: 9781424480845
DOI: 10.1109/APEC.2011.5744626
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