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|Title:||High-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via|
|Authors:||Guo, Y.-X. |
|Source:||Guo, Y.-X.,Chu, H. (2010). High-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via. 2010 IEEE International Conference on Ultra-Wideband, ICUWB2010 - Proceedings 1 : 34-37. ScholarBank@NUS Repository. https://doi.org/10.1109/ICUWB.2010.5615804|
|Abstract:||In this paper, the through silicon via (TSV) technology is employed to design millimeter-wave substrate integrated waveguide (SIW) based on-chip antennas. The TSV based SIW is first characterized with different silicon resistivity, substrate thickness and via pitch size. Then a high-efficiency TSV based SIW antenna is demonstrated. © 2010 IEEE.|
|Source Title:||2010 IEEE International Conference on Ultra-Wideband, ICUWB2010 - Proceedings|
|Appears in Collections:||Staff Publications|
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