High-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via

Please use this identifier to cite or link to this item: https://doi.org/10.1109/ICUWB.2010.5615804

Title:	High-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via
Authors:	Guo, Y.-X. Chu, H.
Issue Date:	2010
Citation:	Guo, Y.-X.,Chu, H. (2010). High-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via. 2010 IEEE International Conference on Ultra-Wideband, ICUWB2010 - Proceedings 1 : 34-37. ScholarBank@NUS Repository. https://doi.org/10.1109/ICUWB.2010.5615804
Abstract:	In this paper, the through silicon via (TSV) technology is employed to design millimeter-wave substrate integrated waveguide (SIW) based on-chip antennas. The TSV based SIW is first characterized with different silicon resistivity, substrate thickness and via pitch size. Then a high-efficiency TSV based SIW antenna is demonstrated. © 2010 IEEE.
Source Title:	2010 IEEE International Conference on Ultra-Wideband, ICUWB2010 - Proceedings
URI:	http://scholarbank.nus.edu.sg/handle/10635/70475
ISBN:	9781424453061
DOI:	10.1109/ICUWB.2010.5615804
Appears in Collections:	Staff Publications

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