Folded silicon resonant accelerometer with temperature compensation

Abstract

In this paper, a novel folded silicon resonant accelerometer is proposed The proposed structure is able to release the stress arising from the mismatch of thermal expansion between silicon structure and glass substrate and to compensate the variation of the natural frequency with temperature. The analysis has shown that both bias and scale factor stability can be improved with the proposed structure. The concept is verified by the simulation and the results show that the temperature dependence of common-mode output frequency can be greatly reduced. © 2004 IEEE.