Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/70353
Title: Folded silicon resonant accelerometer with temperature compensation
Authors: He, L.
Xu, Y.-P. 
Qiu, A.
Keywords: MEMS
Resonant acceleromeler
Resonator
Silicon accelerometer
Temperature compensation
Issue Date: 2004
Source: He, L.,Xu, Y.-P.,Qiu, A. (2004). Folded silicon resonant accelerometer with temperature compensation. Proceedings of IEEE Sensors 1 : 512-515. ScholarBank@NUS Repository.
Abstract: In this paper, a novel folded silicon resonant accelerometer is proposed The proposed structure is able to release the stress arising from the mismatch of thermal expansion between silicon structure and glass substrate and to compensate the variation of the natural frequency with temperature. The analysis has shown that both bias and scale factor stability can be improved with the proposed structure. The concept is verified by the simulation and the results show that the temperature dependence of common-mode output frequency can be greatly reduced. © 2004 IEEE.
Source Title: Proceedings of IEEE Sensors
URI: http://scholarbank.nus.edu.sg/handle/10635/70353
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

17
checked on Dec 9, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.