Please use this identifier to cite or link to this item:
|Title:||Equipment design and control of advanced thermal processing system in lithography|
|Authors:||Tay, A. |
|Citation:||Tay, A., Wang, Y., Chua, H.T. (2007). Equipment design and control of advanced thermal processing system in lithography. IECON Proceedings (Industrial Electronics Conference) : 786-791. ScholarBank@NUS Repository. https://doi.org/10.1109/IECON.2007.4460095|
|Abstract:||A programmable multizone thermal processing module is developed to achieve temperature uniformity of a silicon wafer during the thermal cycling process in lithography. In the proposed unit, the bake and chill steps are conducted sequentially within the same module without any substrate movement. The unit includes two heating sources. The first is a mica heater which serves as the dominant means for heat transfer. The second is a set of thermoelectric devices (TEDs) which are used to provide a distributed amount of heat to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. The system is designed via detailed modeling and simulations based on first principle heat transfer analysis. Experimental results on initial prototype demonstrates less than 0.1°C spatial uniformity during the entire thermal cycle. ©2007 IEEE.|
|Source Title:||IECON Proceedings (Industrial Electronics Conference)|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jan 14, 2019
checked on Dec 15, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.