Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/70068
Title: Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees
Authors: Gan, C.L.
Thompson, C.V.
Pey, K.L.
Choi, W.K. 
Chang, C.W.
Guo, Q.
Keywords: Copper metallization
Electromigration
Interconnect tree
Reliability
Issue Date: 2003
Source: Gan, C.L.,Thompson, C.V.,Pey, K.L.,Choi, W.K.,Chang, C.W.,Guo, Q. (2003). Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees. Annual Proceedings - Reliability Physics (Symposium) : 594-595. ScholarBank@NUS Repository.
Abstract: While the reliability of a dual-damascene via is independent of the number of segments connected to it, it is strongly dependent on the distribution of current among the segments. The most highly stressed segments are not always the least reliable. This behavior for Cu is different than for A1.
Source Title: Annual Proceedings - Reliability Physics (Symposium)
URI: http://scholarbank.nus.edu.sg/handle/10635/70068
ISSN: 00999512
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

25
checked on Dec 9, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.