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| Title: | Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees | Authors: | Gan, C.L. Thompson, C.V. Pey, K.L. Choi, W.K. Chang, C.W. Guo, Q. |
Keywords: | Copper metallization Electromigration Interconnect tree Reliability |
Issue Date: | 2003 | Citation: | Gan, C.L.,Thompson, C.V.,Pey, K.L.,Choi, W.K.,Chang, C.W.,Guo, Q. (2003). Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees. Annual Proceedings - Reliability Physics (Symposium) : 594-595. ScholarBank@NUS Repository. | Abstract: | While the reliability of a dual-damascene via is independent of the number of segments connected to it, it is strongly dependent on the distribution of current among the segments. The most highly stressed segments are not always the least reliable. This behavior for Cu is different than for A1. | Source Title: | Annual Proceedings - Reliability Physics (Symposium) | URI: | http://scholarbank.nus.edu.sg/handle/10635/70068 | ISSN: | 00999512 |
| Appears in Collections: | Staff Publications |
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