Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/69533
Title: Breakdown predictions of microstrip interconnects and coplanar waveguide-built devices in the presence of HP-EMPs
Authors: Yin, W.-Y.
Dong, X.T. 
Mao, J.
Li, L.-W. 
Issue Date: 2006
Source: Yin, W.-Y.,Dong, X.T.,Mao, J.,Li, L.-W. (2006). Breakdown predictions of microstrip interconnects and coplanar waveguide-built devices in the presence of HP-EMPs. 17th International Zurich Symposium on Electromagnetic Compatibility, 2006 2006 : 445-448. ScholarBank@NUS Repository.
Abstract: Electrical breakdown of microstrip interconnects and coplanar waveguide-built devices in the presence of high-power electromagnetic pulses (HP-EMP) is addressed in this paper, and some effective methodologies are outlined and proposed for fast predicting maximum current carrying density of bonding wire, electric field breakdown strength of thin film capacitors, average and peak power handling capabilities of conventional and thin film microstrip and coplanar waveguides. An efficient FDTD procedure is also presented for characterizing electric breakdown strength of the substrate dielectrics based on their high-field conduction models.
Source Title: 17th International Zurich Symposium on Electromagnetic Compatibility, 2006
URI: http://scholarbank.nus.edu.sg/handle/10635/69533
ISBN: 3952299049
Appears in Collections:Staff Publications

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