Breakdown predictions of microstrip interconnects and coplanar waveguide-built devices in the presence of HP-EMPs

Abstract

Electrical breakdown of microstrip interconnects and coplanar waveguide-built devices in the presence of high-power electromagnetic pulses (HP-EMP) is addressed in this paper, and some effective methodologies are outlined and proposed for fast predicting maximum current carrying density of bonding wire, electric field breakdown strength of thin film capacitors, average and peak power handling capabilities of conventional and thin film microstrip and coplanar waveguides. An efficient FDTD procedure is also presented for characterizing electric breakdown strength of the substrate dielectrics based on their high-field conduction models.