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|Title:||An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages|
|Source:||Liu, E.-X.,Wei, X.,Oo, Z.Z.,Li, E.-P. (2007). An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 263-266. ScholarBank@NUS Repository. https://doi.org/10.1109/EPEP.2007.4387177|
|Abstract:||We developed a two-dimensional full wave method for efficient power integrity and EMI Analysis of general power/ground planes in high-speed electronic packages. The resultant equivalent magnetic source from the 2D simulation is used for EMI analysis via the free-space Green's function. Both analytical and experimental validation shows that the method is accurate and efficient. © 2007 IEEE.|
|Source Title:||IEEE Topical Meeting on Electrical Performance of Electronic Packaging|
|Appears in Collections:||Staff Publications|
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