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https://doi.org/10.1109/EPEP.2007.4387177
| Title: | An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages | Authors: | Liu, E.-X. Wei, X. Oo, Z.Z. Li, E.-P. |
Issue Date: | 2007 | Citation: | Liu, E.-X.,Wei, X.,Oo, Z.Z.,Li, E.-P. (2007). An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 263-266. ScholarBank@NUS Repository. https://doi.org/10.1109/EPEP.2007.4387177 | Abstract: | We developed a two-dimensional full wave method for efficient power integrity and EMI Analysis of general power/ground planes in high-speed electronic packages. The resultant equivalent magnetic source from the 2D simulation is used for EMI analysis via the free-space Green's function. Both analytical and experimental validation shows that the method is accurate and efficient. © 2007 IEEE. | Source Title: | IEEE Topical Meeting on Electrical Performance of Electronic Packaging | URI: | http://scholarbank.nus.edu.sg/handle/10635/69304 | ISBN: | 1424408830 | DOI: | 10.1109/EPEP.2007.4387177 |
| Appears in Collections: | Staff Publications |
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