Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPEP.2007.4387177
Title: An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages
Authors: Liu, E.-X.
Wei, X.
Oo, Z.Z.
Li, E.-P. 
Issue Date: 2007
Source: Liu, E.-X.,Wei, X.,Oo, Z.Z.,Li, E.-P. (2007). An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 263-266. ScholarBank@NUS Repository. https://doi.org/10.1109/EPEP.2007.4387177
Abstract: We developed a two-dimensional full wave method for efficient power integrity and EMI Analysis of general power/ground planes in high-speed electronic packages. The resultant equivalent magnetic source from the 2D simulation is used for EMI analysis via the free-space Green's function. Both analytical and experimental validation shows that the method is accurate and efficient. © 2007 IEEE.
Source Title: IEEE Topical Meeting on Electrical Performance of Electronic Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/69304
ISBN: 1424408830
DOI: 10.1109/EPEP.2007.4387177
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