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Title: An MILP approach to automated wet-etch station scheduling
Authors: Bhushan, S.
Karimi, I.A. 
Issue Date: 2-Apr-2003
Citation: Bhushan, S.,Karimi, I.A. (2003-04-02). An MILP approach to automated wet-etch station scheduling. Industrial and Engineering Chemistry Research 42 (7) : 1391-1399. ScholarBank@NUS Repository.
Abstract: Wet-etching in wafer fabrication is an automated process involving a complex interplay of mixed intermediate policies and material-handling constraints. Its operation poses a challenging resource-constrained flowshop scheduling problem that is crucial for enhancing productivity, improving yield, and minimizing wafer contamination. A novel continuous-time mixed-integer linear programming (MILP) formulation is presented for sequencing and scheduling wafer lots in an automated wet-etch station (AWS). Several reformulations and constraints are numerically evaluated to identify the best formulation. On the basis of this formulation, a near-optimum two-step strategy that is robust with respect to lot transfer times is developed for solving moderately sized problems.
Source Title: Industrial and Engineering Chemistry Research
ISSN: 08885885
Appears in Collections:Staff Publications

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