Please use this identifier to cite or link to this item: https://doi.org/10.1007/s10934-006-8013-6
Title: Fabrication of patterned porous silicon using high-energy ion irradiation
Authors: Teo, E.J. 
Breese, M.B.H. 
Bettiol, A.A. 
Champeaux, F.J.T.
Watt, F. 
Blackwood, D.J. 
Keywords: Electrochemical etching
Ion irradiation
Photoluminescence
Porous silicon
Issue Date: Aug-2006
Source: Teo, E.J., Breese, M.B.H., Bettiol, A.A., Champeaux, F.J.T., Watt, F., Blackwood, D.J. (2006-08). Fabrication of patterned porous silicon using high-energy ion irradiation. Journal of Porous Materials 13 (3) : 259-261. ScholarBank@NUS Repository. https://doi.org/10.1007/s10934-006-8013-6
Abstract: P-type silicon has been patterned using high-energy protons beam prior to electrochemical etching in hydrofluoric acid. The ion beam selectively damages the silicon lattice, resulting in an increase in the local resistivity of the irradiated regions. It is found that the photoluminescence intensity of the irradiated regions increases with proton irradiation into a 0.02 Ω.cm resistivity p-type silicon. By immersing the etched sample into potassium hydroxide, the porous silicon is removed to reveal the underlying three-dimensional structure of the patterned area. © Springer Science + Business Media, LLC 2006.
Source Title: Journal of Porous Materials
URI: http://scholarbank.nus.edu.sg/handle/10635/64874
ISSN: 13802224
DOI: 10.1007/s10934-006-8013-6
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