Please use this identifier to cite or link to this item: https://doi.org/10.1109/66.827348
Title: Optimal predictive control with constraints for the processing of semiconductor wafers on bake plates
Authors: Ho, W.K. 
Tay, A. 
Schaper, C.D.
Issue Date: 2000
Source: Ho, W.K.,Tay, A.,Schaper, C.D. (2000). Optimal predictive control with constraints for the processing of semiconductor wafers on bake plates. IEEE Transactions on Semiconductor Manufacturing 13 (1) : 88-96. ScholarBank@NUS Repository. https://doi.org/10.1109/66.827348
Abstract: An optimal control scheme is designed to improve repeatability by minimizing the loading effects induced by the common processing condition of placement of a semiconductor wafer at ambient temperature on a large thermal-mass bake plate at processing temperature. The optimal control strategy is a model-based method using linear programming to minimize the worst-case deviation from a nominal temperature set point during the load disturbance condition. This results in a predictive controller that performs a predetermined heating sequence prior to the arrival of the wafer as part of the resulting feedforward/feedback strategy to eliminate the load disturbance. This procedure is based on an empirical model generated from data obtained during closed-loop operation. It is easy to design and implement for conventional thermal processing equipment. Experimental results are performed for a commercial conventional bake plate and depict an order-of-magnitude improvement in the settling time and the integral-square temperature error between the optimal predictive controller and a feedback controller for a typical load disturbance.
Source Title: IEEE Transactions on Semiconductor Manufacturing
URI: http://scholarbank.nus.edu.sg/handle/10635/62560
ISSN: 08946507
DOI: 10.1109/66.827348
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