Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis

Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.ijheatmasstransfer.2006.02.047

Title:	Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis
Authors:	Chakraborty, A. Saha, B.B. Koyama, S. Ng, K.C.
Issue Date:	Sep-2006
Citation:	Chakraborty, A., Saha, B.B., Koyama, S., Ng, K.C. (2006-09). Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis. International Journal of Heat and Mass Transfer 49 (19-20) : 3547-3554. ScholarBank@NUS Repository. https://doi.org/10.1016/j.ijheatmasstransfer.2006.02.047
Abstract:	This article presents the temperature-entropy analysis, where the Thomson effect bridges the Joule heat and the Fourier heat across the thermoelectric elements of a thermoelectric cooling cycle to describe the principal energy flows and performance bottlenecks or dissipations. Starting from the principles of thermodynamics of thermoelectricity, differential governing equations describing the energy and entropy flows of the thermoelectric element are discussed. The temperature-entropy (T-S) profile in a single Peltier element is pictured for temperature dependent Seebeck coefficient and illustrated with data from commercial available thermoelectric cooler. © 2006 Elsevier Ltd. All rights reserved.
Source Title:	International Journal of Heat and Mass Transfer
URI:	http://scholarbank.nus.edu.sg/handle/10635/61559
ISSN:	00179310
DOI:	10.1016/j.ijheatmasstransfer.2006.02.047
Appears in Collections:	Staff Publications

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