Please use this identifier to cite or link to this item:
|Title:||Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis|
|Citation:||Chakraborty, A., Saha, B.B., Koyama, S., Ng, K.C. (2006-09). Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis. International Journal of Heat and Mass Transfer 49 (19-20) : 3547-3554. ScholarBank@NUS Repository. https://doi.org/10.1016/j.ijheatmasstransfer.2006.02.047|
|Abstract:||This article presents the temperature-entropy analysis, where the Thomson effect bridges the Joule heat and the Fourier heat across the thermoelectric elements of a thermoelectric cooling cycle to describe the principal energy flows and performance bottlenecks or dissipations. Starting from the principles of thermodynamics of thermoelectricity, differential governing equations describing the energy and entropy flows of the thermoelectric element are discussed. The temperature-entropy (T-S) profile in a single Peltier element is pictured for temperature dependent Seebeck coefficient and illustrated with data from commercial available thermoelectric cooler. © 2006 Elsevier Ltd. All rights reserved.|
|Source Title:||International Journal of Heat and Mass Transfer|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jul 12, 2018
WEB OF SCIENCETM
checked on Jun 5, 2018
checked on Mar 11, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.