Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/60644
Title: Lead-free solder reinforced with multiwalled carbon nanotubes
Authors: Nai, S.M.L.
Wei, J.
Gupta, M. 
Keywords: Carbon nanotubes
Composites
Lead-free solder
Issue Date: Jul-2006
Source: Nai, S.M.L.,Wei, J.,Gupta, M. (2006-07). Lead-free solder reinforced with multiwalled carbon nanotubes. Journal of Electronic Materials 35 (7) : 1518-1522. ScholarBank@NUS Repository.
Abstract: In this study, varying weight percentages of multiwalled carbon nanotubes were successfully incorporated into 95.8Sn-3.5Ag-0.7Cu solder to synthesize novel lead-free composite solders. The composite solders were synthesized using a powder metallurgy route consisting of blending, compaction, sintering, and extrusion. The extruded materials were then characterized for their physical, thermal, and mechanical properties. With the addition of increasing weight percentage of carbon nanotubes, the composite solders experienced a corresponding decrease in density values and an improvement in wetting properties. The melting temperatures of the composite solders were found to be unchanged with additions of carbon nanotubes. However, improvements in the mechanical properties, in terms of microhardness and tensile properties, were observed with increasing weight percentages of carbon nanotubes.
Source Title: Journal of Electronic Materials
URI: http://scholarbank.nus.edu.sg/handle/10635/60644
ISSN: 03615235
Appears in Collections:Staff Publications

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