Please use this identifier to cite or link to this item:
|Title:||Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites|
Metal matrix nanocomposites
|Source:||Babaghorbani, P., Nai, S.M.L., Gupta, M. (2009). Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites. Materials Science and Technology 25 (10) : 1258-1264. ScholarBank@NUS Repository. https://doi.org/10.1179/174328408X378582|
|Abstract:||In the present study, copper at the nanometer length scale is integrated with Sn-3·5Ag using the technique of powder metallurgy incorporating energy efficient microwave sintering. Superior mechanical characteristics were realised for the formulations containing nanometer length scale copper in excess of 1 vol.-%. Sn-3·5Ag reinforced with 2·5 vol.% nanosize copper particulates exhibited the best overall mechanical characteristics. Particular emphasis is placed on studying the effect of the increasing presence of nanosize copper particulates on the microstructure and property evolution of the Sn-3·5Ag matrix. © 2009 Institute of Materials, Minerals and Mining.|
|Source Title:||Materials Science and Technology|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Mar 7, 2018
WEB OF SCIENCETM
checked on Feb 5, 2018
checked on Mar 11, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.