Please use this identifier to cite or link to this item: https://doi.org/10.1179/174328408X378582
Title: Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites
Authors: Babaghorbani, P.
Nai, S.M.L.
Gupta, M. 
Keywords: Lead-free solder
Mechanical behaviour
Metal matrix nanocomposites
Microwave sintering
Issue Date: 2009
Source: Babaghorbani, P.,Nai, S.M.L.,Gupta, M. (2009). Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites. Materials Science and Technology 25 (10) : 1258-1264. ScholarBank@NUS Repository. https://doi.org/10.1179/174328408X378582
Abstract: In the present study, copper at the nanometer length scale is integrated with Sn-3·5Ag using the technique of powder metallurgy incorporating energy efficient microwave sintering. Superior mechanical characteristics were realised for the formulations containing nanometer length scale copper in excess of 1 vol.-%. Sn-3·5Ag reinforced with 2·5 vol.% nanosize copper particulates exhibited the best overall mechanical characteristics. Particular emphasis is placed on studying the effect of the increasing presence of nanosize copper particulates on the microstructure and property evolution of the Sn-3·5Ag matrix. © 2009 Institute of Materials, Minerals and Mining.
Source Title: Materials Science and Technology
URI: http://scholarbank.nus.edu.sg/handle/10635/60571
ISSN: 02670836
DOI: 10.1179/174328408X378582
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