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|Title:||Evelopment of novel lead-free solder composites using carbon nanotube reinforcements|
|Citation:||Nai, S.M.L., Gupta, M., Wei, J. (2005-08). Evelopment of novel lead-free solder composites using carbon nanotube reinforcements. International Journal of Nanoscience 4 (4) : 423-429. ScholarBank@NUS Repository. https://doi.org/10.1142/S0219581X0500367X|
|Abstract:||In this study, Sn-Ag-Cu based nanocomposites with carbon nanotubes (CNTs) as reinforcements were successfully synthesized via the powder metallurgy technique. Lead-free solder powders were firstly blended together with varying weight percentages of CNTs. The materials were then compacted, sintered and finally extruded at room temperature. The extruded materials were characterized for their microstructural, thermal and mechanical properties. The porosity of the nanocomposites was observed to increase with increasing weight percentages of CNTs, accordingly the density of the nanocomposites was reduced. Thermomechanical analysis of the solder nanocomposites showed that the use of CNTs as reinforcements decreased the average coefficient of thermal expansion of the solder matrix. Furthermore, the results of mechanical properties characterization revealed that the addition of CNTs aids in enhancing the microhardness and the overall strength of the nanocomposite solder. An attempt is made in the present study to correlate the variation in weight percentages of the carbon nanotubes with the properties of the resultant nanocomposite materials. © World Scientific Publishing Company.|
|Source Title:||International Journal of Nanoscience|
|Appears in Collections:||Staff Publications|
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