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|Title:||Electroless metallization of dielectric SiLK surfaces functionalized by viologen|
|Citation:||Yu, W.H., Zhang, Y., Kang, E.T., Neoh, K.G., Wu, S.Y., Chow, Y.F. (2003-08). Electroless metallization of dielectric SiLK surfaces functionalized by viologen. Journal of the Electrochemical Society 150 (8) : F156-F163. ScholarBank@NUS Repository. https://doi.org/10.1149/1.1589022|
|Abstract:||Surface functionalization of the Ar plasma-pretreated SiLK coating on (100)-oriented silicon wafer (SiLK-Si substrate) via graft modification with viologen (1,1′-substituted-4,4′-bipyridinium salt) was carried out. The method involved a two-step process whereby 4-vinylbenzyl chloride (VBC) was first graft copolymerized, via UV induction, on the Ar plasma-pretreated SiLK-Si substrate surface (the VBC-g-SiLK-Si surface). The benzyl chloride groups of the grafted VBC chains were subsequently coupled with viologen (the viologen-g-SiLK-Si surface). The surface composition and topography of the graft-functionalized SiLK-Si substrates were characterized by X-ray photoelectron spectroscopy and atomic force microscopy, respectively. Pd(II) and Au(III) ions could be adsorbed onto the viologen-g-SiLK-Si surfaces and subsequently reduced to their respective metal atoms under UV irradiation. Electroless deposition of copper could be carried out effectively on the viologen-g-SiLK-Si surfaces with the photoreduced palladium metal. The 180°-peel adhesion strength of the electrolessly deposited copper with the viologen-g-SiLK-Si surface reached about 5 N/cm. Thus, not only did the surface grafted viologen molecules provide the chemisorption sites for the photoreduction of the palladium catalyst, they also served as adhesion promoters for the electrolessly deposited copper.|
|Source Title:||Journal of the Electrochemical Society|
|Appears in Collections:||Staff Publications|
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