Please use this identifier to cite or link to this item: https://doi.org/10.1007/s11664-009-0925-x
Title: Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
Authors: Alam, M.E.
Nai, S.M.L.
Gupta, M. 
Keywords: Aging
Intermetallic compound thickness
Sn-Cu solder
Issue Date: Dec-2009
Source: Alam, M.E.,Nai, S.M.L.,Gupta, M. (2009-12). Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates. Journal of Electronic Materials 38 (12) : 2479-2488. ScholarBank@NUS Repository. https://doi.org/10.1007/s11664-009-0925-x
Abstract: In the present study, Sn-Cu solders were synthesized using pure tin with varying weight percentage of nanosized copper particles (0 wt.%, 0.25 wt.%, 0.43 wt.%, 0.86 wt.%, and 1.35 wt.%) by a powder metallurgy route incorporating microwave-assisted sintering. Intermetallic compound (IMC) layer formation between Sn-Cu solders and Cu substrates was investigated following a reflow process. Isothermal aging studies were also conducted on selected Sn-Cu solders at 150°C for up to 4 weeks. Results revealed that the average IMC layer thickness decreases with the addition of nanocopper up to 0.43 wt.%. Beyond 0.43 wt.% Cu addition, the IMC layer thickness started to increase, and the maximum IMC layer thickness was found for Sn with 1.35 wt.% Cu addition. An attempt was made in this study to correlate the effect of nanocopper additions and aging time on the IMC layer thicknesses. © 2009 TMS.
Source Title: Journal of Electronic Materials
URI: http://scholarbank.nus.edu.sg/handle/10635/60028
ISSN: 03615235
DOI: 10.1007/s11664-009-0925-x
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