Please use this identifier to cite or link to this item:
Title: Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
Authors: Alam, M.E.
Nai, S.M.L.
Gupta, M. 
Keywords: Aging
Intermetallic compound thickness
Sn-Cu solder
Issue Date: Dec-2009
Citation: Alam, M.E., Nai, S.M.L., Gupta, M. (2009-12). Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates. Journal of Electronic Materials 38 (12) : 2479-2488. ScholarBank@NUS Repository.
Abstract: In the present study, Sn-Cu solders were synthesized using pure tin with varying weight percentage of nanosized copper particles (0 wt.%, 0.25 wt.%, 0.43 wt.%, 0.86 wt.%, and 1.35 wt.%) by a powder metallurgy route incorporating microwave-assisted sintering. Intermetallic compound (IMC) layer formation between Sn-Cu solders and Cu substrates was investigated following a reflow process. Isothermal aging studies were also conducted on selected Sn-Cu solders at 150°C for up to 4 weeks. Results revealed that the average IMC layer thickness decreases with the addition of nanocopper up to 0.43 wt.%. Beyond 0.43 wt.% Cu addition, the IMC layer thickness started to increase, and the maximum IMC layer thickness was found for Sn with 1.35 wt.% Cu addition. An attempt was made in this study to correlate the effect of nanocopper additions and aging time on the IMC layer thicknesses. © 2009 TMS.
Source Title: Journal of Electronic Materials
ISSN: 03615235
DOI: 10.1007/s11664-009-0925-x
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.


checked on Mar 19, 2019


checked on Mar 19, 2019

Page view(s)

checked on Mar 9, 2019

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.