Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.microrel.2006.05.012
Title: Dynamic responses and solder joint reliability under board level drop test
Authors: Luan, J.-e.
Tee, T.Y.
Pek, E.
Lim, C.T. 
Zhong, Z.
Issue Date: Feb-2007
Source: Luan, J.-e.,Tee, T.Y.,Pek, E.,Lim, C.T.,Zhong, Z. (2007-02). Dynamic responses and solder joint reliability under board level drop test. Microelectronics Reliability 47 (2-3) : 450-460. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2006.05.012
Abstract: Board level solder joint reliability during drop test is a great concern to semiconductor and electronic product manufacturers. In this paper, the comprehensive dynamic responses of printed circuit boards (PCBs) and solder joints, e.g., acceleration, strains, and resistance, are measured and analyzed in detail with a multi-channel real-time electrical monitoring system. Control and monitoring of dynamic responses are very important to ensure consistent test results and understand the mechanical behaviors, as they are closely related to the solder joint failure mechanism. The effects of test variables, such as drop height, number of PCB mounting screws, tightness of screws, and number of felt layer, are studied by comparing and analyzing the dynamic responses. A good repeatability of testing can only be achieved when careful attentions are paid on these factors. The relationships among drop height, peak acceleration, pulse duration, and impact energy are unique for a drop tester, and therefore, it should be characterized prior to the reliability tests. The studies also help to determine the requirements of new impact pulse quickly. The bending mode shapes and frequencies of PCB are extracted from dynamic strains and images token by high-speed camera. A real-time dynamic resistance monitoring method is developed to study the solder joint reliability. The solder joint failure process, i.e. crack initiation, propagation, and opening, is well understood from the behavior of dynamic resistance. It is found experimentally that the mechanical shock causes multiple PCB bending or vibration which induces the solder joint crack failure. Cyclic changes of dynamic resistance indicate that the solder joint crack opens and closes when PCB bends up and down. © 2006.
Source Title: Microelectronics Reliability
URI: http://scholarbank.nus.edu.sg/handle/10635/60012
ISSN: 00262714
DOI: 10.1016/j.microrel.2006.05.012
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

42
checked on Dec 12, 2017

Page view(s)

34
checked on Dec 15, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.