Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.applthermaleng.2006.12.013
Title: Application of phase change materials in thermal management of electronics
Authors: Kandasamy, R.
Wang, X.-Q. 
Mujumdar, A.S. 
Keywords: Cyclic steady state
Electronics cooling
Phase change materials
Thermal management
Issue Date: Dec-2007
Source: Kandasamy, R., Wang, X.-Q., Mujumdar, A.S. (2007-12). Application of phase change materials in thermal management of electronics. Applied Thermal Engineering 27 (17-18) : 2822-2832. ScholarBank@NUS Repository. https://doi.org/10.1016/j.applthermaleng.2006.12.013
Abstract: Application of a novel PCM package for thermal management of portable electronic devices was investigated experimentally for effects of various parameters e.g. power input, orientation of package, and various melting/freezing times under cyclic steady conditions. Also, a two-dimensional numerical study was made and compared the experimental results. Results show that increased power inputs increase the melting rate, while orientation of the package to gravity has negligible effect on the thermal performance of the PCM package. The thermal resistance of the device and the power level applied to the PCM package are of critical importance for design of a passive thermal control system. Comparison with numerical results confirms that PCM-based design is an excellent candidate design for transient electronic cooling applications. © 2007.
Source Title: Applied Thermal Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/59567
ISSN: 13594311
DOI: 10.1016/j.applthermaleng.2006.12.013
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