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Title: Analytical solutions for PCB assembly subjected to mismatched thermal expansion
Authors: Wong, E.H.
Lim, K.M. 
Mai, Y.-W.
Keywords: Analytical solutions
Electronics packaging
Solder joints
Thermal stress
Issue Date: 2009
Citation: Wong, E.H., Lim, K.M., Mai, Y.-W. (2009). Analytical solutions for PCB assembly subjected to mismatched thermal expansion. IEEE Transactions on Advanced Packaging 32 (3) : 602-611. ScholarBank@NUS Repository.
Abstract: Thermal stress due to mismatched thermal expansion is a problem that has challenged the electronics packaging industry for decades. Analytical solutions are available in the literature for a tri-material in which the sandwiched layer is an adhesive, but the solutions may not be suitable for a sandwiched layer consisting of discrete elements such as solder joints which experience significant bending. In this paper, closed-form analytical solutions have been developed for both continuous and discrete sandwiched layers by modelling the interconnects as a slab of spring elements capable of transferring axial, shear, and bending load. The analytical solutions have been successfully validated with finite element analysis. © 2009 IEEE.
Source Title: IEEE Transactions on Advanced Packaging
ISSN: 15213323
DOI: 10.1109/TADVP.2009.2025222
Appears in Collections:Staff Publications

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