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|Title:||Analytical solutions for PCB assembly subjected to mismatched thermal expansion|
|Citation:||Wong, E.H., Lim, K.M., Mai, Y.-W. (2009). Analytical solutions for PCB assembly subjected to mismatched thermal expansion. IEEE Transactions on Advanced Packaging 32 (3) : 602-611. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2009.2025222|
|Abstract:||Thermal stress due to mismatched thermal expansion is a problem that has challenged the electronics packaging industry for decades. Analytical solutions are available in the literature for a tri-material in which the sandwiched layer is an adhesive, but the solutions may not be suitable for a sandwiched layer consisting of discrete elements such as solder joints which experience significant bending. In this paper, closed-form analytical solutions have been developed for both continuous and discrete sandwiched layers by modelling the interconnects as a slab of spring elements capable of transferring axial, shear, and bending load. The analytical solutions have been successfully validated with finite element analysis. © 2009 IEEE.|
|Source Title:||IEEE Transactions on Advanced Packaging|
|Appears in Collections:||Staff Publications|
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