Please use this identifier to cite or link to this item:
|Title:||An optical shadowgraph microscope for a semiconductor wafer bump height measurement|
|Authors:||Wang, S. |
|Citation:||Wang, S., Quan, C., Tay, C.J. (2005-04). An optical shadowgraph microscope for a semiconductor wafer bump height measurement. Review of Scientific Instruments 76 (4) : -. ScholarBank@NUS Repository. https://doi.org/10.1063/1.1879312|
|Abstract:||We describe an optical micro shadowgraph for measuring the height of a micro solderball on a semiconductor wafer. The proposed optical system consists of a white-light microscopic inclination illumination and a telecentric objective. The solderball shadow image resulting from a slant illumination onto the protruded bump/solderball on the wafer is clearly captured. In terms of geometrical optics, a formula is derived to resolve the bump height from the length of the resulting shadow on the wafer surface. Experimental results demonstrate that the bump height measurement can be readily implemented. © 2005 American Institute of Physics.|
|Source Title:||Review of Scientific Instruments|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jul 6, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.