Please use this identifier to cite or link to this item: https://doi.org/10.1063/1.1879312
Title: An optical shadowgraph microscope for a semiconductor wafer bump height measurement
Authors: Wang, S. 
Quan, C. 
Tay, C.J. 
Issue Date: Apr-2005
Source: Wang, S., Quan, C., Tay, C.J. (2005-04). An optical shadowgraph microscope for a semiconductor wafer bump height measurement. Review of Scientific Instruments 76 (4) : -. ScholarBank@NUS Repository. https://doi.org/10.1063/1.1879312
Abstract: We describe an optical micro shadowgraph for measuring the height of a micro solderball on a semiconductor wafer. The proposed optical system consists of a white-light microscopic inclination illumination and a telecentric objective. The solderball shadow image resulting from a slant illumination onto the protruded bump/solderball on the wafer is clearly captured. In terms of geometrical optics, a formula is derived to resolve the bump height from the length of the resulting shadow on the wafer surface. Experimental results demonstrate that the bump height measurement can be readily implemented. © 2005 American Institute of Physics.
Source Title: Review of Scientific Instruments
URI: http://scholarbank.nus.edu.sg/handle/10635/59504
ISSN: 00346748
DOI: 10.1063/1.1879312
Appears in Collections:Staff Publications

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