Please use this identifier to cite or link to this item: https://doi.org/10.1080/14786430601032386
Title: Adsorption characteristics of parent and copper-sputtered RD silica gels
Authors: Saha, B.B.
Chakraborty, A.
Koyama, S.
Lee, J.-B.
He, J.
Ng, K.C. 
Issue Date: Mar-2007
Source: Saha, B.B., Chakraborty, A., Koyama, S., Lee, J.-B., He, J., Ng, K.C. (2007-03). Adsorption characteristics of parent and copper-sputtered RD silica gels. Philosophical Magazine 87 (7) : 1113-1121. ScholarBank@NUS Repository. https://doi.org/10.1080/14786430601032386
Abstract: Surface modification of type RD silica gel was achieved by depositing layers of thin-film copper on the parent silica gel surfaces so as to improve their performances, circumventing the poor thermal conductivity of the adsorbent. Porous properties (surface area, pore size and volume) were determined using nitrogen adsorption/desorption isotherm measurements, which were performed on adsorbents for both parent and Cu-sputtered silica gels in liquid nitrogen at a temperature of 77.4K. The copper sputtering experiments were conducted in a chamber of inert argon gas where the chamber was bombarded with a radio frequency (RF) of 13.56MHz. The comparative performance of the parent and Cu-sputtered silica gels was determined via various key measurements such the Brunauer-Emmett-Teller (BET), the Horvath and Kawazoe (HK) and the hot-disc sensor methods.
Source Title: Philosophical Magazine
URI: http://scholarbank.nus.edu.sg/handle/10635/59379
ISSN: 14786435
DOI: 10.1080/14786430601032386
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