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|Title:||On control of resist film uniformity in the microlithography process|
|Authors:||Ho, W.K. |
|Keywords:||Generalized predictive control|
|Source:||Ho, W.K., Tay, A., Lee, L.L., Schaper, C.D. (2004-07). On control of resist film uniformity in the microlithography process. Control Engineering Practice 12 (7) : 881-892. ScholarBank@NUS Repository. https://doi.org/10.1016/j.conengprac.2003.12.001|
|Abstract:||A novel approach to improve photoresist thickness uniformity after the conventional spin-coating and softbake process is proposed in this paper. Using an array of thickness sensors, a multizone programmable bakeplate, and model-based control techniques, the temperature distribution of the bakeplate is manipulated in real-time to reduce photoresist thickness non-uniformity. To prevent the decomposition of photoactive compound in the photoresist, the bakeplate temperature is constrained. We have experimentally obtained a repeatable improvement in resist thickness uniformity from wafer-to-wafer and across each wafer. Thickness non-uniformity of less than 10 Å has been obtained. On average, there is a 10× improvement in the thickness uniformity as compared to conventional softbake process. © 2004 Elsevier Ltd. All rights reserved.|
|Source Title:||Control Engineering Practice|
|Appears in Collections:||Staff Publications|
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