Please use this identifier to cite or link to this item:
Title: On control of resist film uniformity in the microlithography process
Authors: Ho, W.K. 
Tay, A. 
Lee, L.L.
Schaper, C.D.
Keywords: Generalized predictive control
Photoresist processing
Semiconductor manufacturing
Temperature control
Issue Date: Jul-2004
Source: Ho, W.K., Tay, A., Lee, L.L., Schaper, C.D. (2004-07). On control of resist film uniformity in the microlithography process. Control Engineering Practice 12 (7) : 881-892. ScholarBank@NUS Repository.
Abstract: A novel approach to improve photoresist thickness uniformity after the conventional spin-coating and softbake process is proposed in this paper. Using an array of thickness sensors, a multizone programmable bakeplate, and model-based control techniques, the temperature distribution of the bakeplate is manipulated in real-time to reduce photoresist thickness non-uniformity. To prevent the decomposition of photoactive compound in the photoresist, the bakeplate temperature is constrained. We have experimentally obtained a repeatable improvement in resist thickness uniformity from wafer-to-wafer and across each wafer. Thickness non-uniformity of less than 10 Å has been obtained. On average, there is a 10× improvement in the thickness uniformity as compared to conventional softbake process. © 2004 Elsevier Ltd. All rights reserved.
Source Title: Control Engineering Practice
ISSN: 09670661
DOI: 10.1016/j.conengprac.2003.12.001
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.


checked on Jan 17, 2018


checked on Dec 5, 2017

Page view(s)

checked on Jan 14, 2018

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.