Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.conengprac.2003.12.001
Title: On control of resist film uniformity in the microlithography process
Authors: Ho, W.K. 
Tay, A. 
Lee, L.L.
Schaper, C.D.
Keywords: Generalized predictive control
Photoresist processing
Semiconductor manufacturing
Temperature control
Issue Date: Jul-2004
Source: Ho, W.K., Tay, A., Lee, L.L., Schaper, C.D. (2004-07). On control of resist film uniformity in the microlithography process. Control Engineering Practice 12 (7) : 881-892. ScholarBank@NUS Repository. https://doi.org/10.1016/j.conengprac.2003.12.001
Abstract: A novel approach to improve photoresist thickness uniformity after the conventional spin-coating and softbake process is proposed in this paper. Using an array of thickness sensors, a multizone programmable bakeplate, and model-based control techniques, the temperature distribution of the bakeplate is manipulated in real-time to reduce photoresist thickness non-uniformity. To prevent the decomposition of photoactive compound in the photoresist, the bakeplate temperature is constrained. We have experimentally obtained a repeatable improvement in resist thickness uniformity from wafer-to-wafer and across each wafer. Thickness non-uniformity of less than 10 Å has been obtained. On average, there is a 10× improvement in the thickness uniformity as compared to conventional softbake process. © 2004 Elsevier Ltd. All rights reserved.
Source Title: Control Engineering Practice
URI: http://scholarbank.nus.edu.sg/handle/10635/56858
ISSN: 09670661
DOI: 10.1016/j.conengprac.2003.12.001
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