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|Title:||Electromagnetic compatibility-oriented study on through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) arrays|
|Keywords:||Complex effective conductivity|
equivalent lumped-element circuit model
through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) array
transient coupling noise
transmission-line method (TLM)
|Citation:||Zhao, W.-S., Yin, W.-Y., Guo, Y.-X. (2012-02). Electromagnetic compatibility-oriented study on through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) arrays. IEEE Transactions on Electromagnetic Compatibility 54 (1) : 149-157. ScholarBank@NUS Repository. https://doi.org/10.1109/TEMC.2011.2167336|
|Abstract:||Electromagnetic compatibility-oriented study is performed for accurately characterizing through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) array in this paper. Based on the modified equivalent lumped-element circuit model of a pair of TS-SWCNTBVs, its forward transmission coefficient, in comparison with copper- and tungsten-based TSVs, is investigated for different metallic fractions of the SWCNTs, with quantum effects treated appropriately. The 3-D transmission-line method (TLM) is further employed for studying mutual couplings in three, four, and nine TS-SWCNTBV arrays, respectively, where the effects of their geometrical and physical parameters on the effective capacitance and conductance are examined in detail. Also, transient coupling noises in different arrays excited by a clock signal, respectively, are predicted and compared, which are useful for the design of high density TS-SWCNTBV arrays with better signal transmission performance. © 2006 IEEE.|
|Source Title:||IEEE Transactions on Electromagnetic Compatibility|
|Appears in Collections:||Staff Publications|
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