Please use this identifier to cite or link to this item: https://doi.org/10.1109/TEMC.2011.2167336
Title: Electromagnetic compatibility-oriented study on through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) arrays
Authors: Zhao, W.-S.
Yin, W.-Y.
Guo, Y.-X. 
Keywords: Complex effective conductivity
equivalent lumped-element circuit model
mutual coupling
quantum effects
through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) array
transient coupling noise
transmission-line method (TLM)
Issue Date: Feb-2012
Source: Zhao, W.-S., Yin, W.-Y., Guo, Y.-X. (2012-02). Electromagnetic compatibility-oriented study on through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) arrays. IEEE Transactions on Electromagnetic Compatibility 54 (1) : 149-157. ScholarBank@NUS Repository. https://doi.org/10.1109/TEMC.2011.2167336
Abstract: Electromagnetic compatibility-oriented study is performed for accurately characterizing through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) array in this paper. Based on the modified equivalent lumped-element circuit model of a pair of TS-SWCNTBVs, its forward transmission coefficient, in comparison with copper- and tungsten-based TSVs, is investigated for different metallic fractions of the SWCNTs, with quantum effects treated appropriately. The 3-D transmission-line method (TLM) is further employed for studying mutual couplings in three, four, and nine TS-SWCNTBV arrays, respectively, where the effects of their geometrical and physical parameters on the effective capacitance and conductance are examined in detail. Also, transient coupling noises in different arrays excited by a clock signal, respectively, are predicted and compared, which are useful for the design of high density TS-SWCNTBV arrays with better signal transmission performance. © 2006 IEEE.
Source Title: IEEE Transactions on Electromagnetic Compatibility
URI: http://scholarbank.nus.edu.sg/handle/10635/55826
ISSN: 00189375
DOI: 10.1109/TEMC.2011.2167336
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