Please use this identifier to cite or link to this item: https://doi.org/10.1115/IPACK2007-33991
Title: Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration
Authors: Tay, A.A.O. 
Ho, S.L.
Issue Date: 2007
Source: Tay, A.A.O.,Ho, S.L. (2007). Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration. 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 1 : 117-122. ScholarBank@NUS Repository. https://doi.org/10.1115/IPACK2007-33991
Abstract: This paper describes a parametric study of the reliability of solder joints in wafer level flip chip packages that employ copper column interconnects. In this study, the impact of the change in the compliance of the copper column interconnects on the fatigue life of the solder joints were investigated by varying the diameter of the copper column interconnects. 2-D elastic-plastic finite element analyses were carried out on packages with constant interconnect diameter as well as those with variable interconnect diameters within the same package. The effect of changing the pitch and the pad size were also studied. It was found that an effective strategy in increasing the fatigue life and hence the reliability of the solder joints is by distributing copper columns of lower compliance (greater diameter) near the center of the package and increasing the compliance of the copper columns (decreasing their diameter) towards the perimeter of the chip package. In addition, elastic-plastic-creep analysis was also performed on the packages. It was observed that the results from the elastic-plastic analysis and the elastic-plastic-creep analysis exhibit the same trend. Copyright © 2007 by ASME.
Source Title: 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
URI: http://scholarbank.nus.edu.sg/handle/10635/51637
ISBN: 0791842770
DOI: 10.1115/IPACK2007-33991
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

16
checked on Feb 16, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.