Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/32635
Title: Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate
Authors: ZHANG, JUNFENG 
CUI, CHENG QIANG 
LIM, THIAM BENG 
KANG, EN-TANG 
Issue Date: 1-Apr-2003
Source: ZHANG, JUNFENG,CUI, CHENG QIANG,LIM, THIAM BENG,KANG, EN-TANG (2003-04-01). Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate. ScholarBank@NUS Repository.
Abstract: The present invention is directed to a method for the lamination of fluoropolymers to the surfaces of metals, and especially to copper, gold, and platinum, and to printed circuit board (PCB) substrate at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of metals in the presence of a functional monomer and an adhesive such as an epoxy resin. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The laminated fluoropolymer-metal or fluoropolymer-PCB substrate interfaces exhibit T-peel strengths of no less than 8 N/cm. This invention can also be applied to substantially improve the adhesion between PCB substrates and metals.
URI: http://scholarbank.nus.edu.sg/handle/10635/32635
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