Thermosyphon flow for cooling of compact devices

Abstract

The challenge of power dissipation in compact devices requires advanced cooling systems. In the present study, three novel cooling systems with essential attributes of compactness, low-cost, high cooling capacity, and orientation-free design are developed. A two-phase thermosyphon water-cooled condenser system was built and used in an experiment and numerical investigation of the effect of heat load on chip temperature. The effect of heat load on temperature difference between chip and inlet cooling water, and the heat load vs heat dissipation were also studied. A new designed of a helical-grooved heat pipe was then fabricated for an experimental study in obtaining the operating temperature as well as temperature distribution along the heat pipe axis for varying conditions, and the thermal resistance and overall heat transfer coefficient over a range of temperatures. Finally, a new design of a sintered heat pipe was fabricated for experiments to obtain a comparison with previous studies of a helical-grooved heat pipe.