Stability analysis of electromolded nanoislands in heteroepitaxial systems

Abstract

The self-assembly of nanostructures on thin films is a promising approach to satisfy the ever shrinking demands in electronics. In this thesis, we study the response of dielectric films and conducting films to the presence of an electric field. Our findings indicate a relationship between an electric plate pattern and a film profile - electromolding. This motivates us to develop a methodology of designing an electric plate that can electromold the film to a specified accuracy. One advantage is that the electrical parameters can be easily adjusted to modify the film profile. Furthermore, the electric plate can be reused, or when required, replaced easily by a plate of a more advanced design. Examples of electromolding are shown for the cases of bumps, rings, wires, quantum cellular arrays, FCC dot arrays, and Y-junctions. The results are qualitative, but clearly demonstrate the potential of electromolding in the future of electronics.