Development of Lead-Free Electroless Nickel Plating systems and Metal Thin Films on Silicone and Nafion membranes

Abstract

Lead (II) that is harmful to human beings is generally used as the stabilizer to prevent electroless nickel plating (ENP) system from decomposing. In the first part of this thesis, three kinds of environment friendly and effective bath stabilizers are presented. The effects of these stabilizers on the properties of ENP process and EN deposits are discussed in detail. Among them, cysteine, methionine and Bi(III) -complex ions are anodic stabilizers; while phosphines are cathodic stabilizers.In the second part, methods for metallization of polymers are reported. The Ni-P film on PDMS surface shows high electrical conductivity and an electromagnetic interference (EMI) shielding property; while the Pt or Pt-Au bimetallic thin layer on Nafion membrane displays better electrode reactivity than the normally used carbon black supported PtRu catalyst.