Efficient modeling of power and signal integrity for semiconductors and advanced electronic package systems

Abstract

The thesis focuses on developing accurate and efficient modeling and simulation methods for power and signal integrity analysis of power distribution networks in advanced electronic packages.A systematic approach of efficient system-level simulation for an electronic package is illustrated. The electronic package is separated into two domains: the top/bottom domain and the inner domain. The former comprises signal traces, via transitions. The latter consists of parallel-plate power-ground planes and vias. The semi-analytical scattering matrix method is developed for analysis of the multiple scattering of vias. A novel boundary modeling method is then proposed to simulate the finite power-ground planes of real world package.An efficient modeling technique based on modal decomposition of the electromagnetic fields is proposed for system-level analysis of electronic packages. Numerical experiments are provided for validation of the developed algorithm. The results demonstrate that the proposed method is accurate and efficient to address the power integrity analysis of real-world electronic packages.