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Title: Microwave device characterization
Keywords: surface mounted package; multi-conductor transmission line; coplanar; characterization; lump element model;
Issue Date: 29-Oct-2004
Citation: MYAT MYITZU SOE (2004-10-29). Microwave device characterization. ScholarBank@NUS Repository.
Abstract: The emerging applications of wireless communications call for an effective low-cost approach to the microwave and RF packaging so as to meet the demand of the commercial market place. To ensure a good package design, development of characterization techniques for surface mounted package is thus necessary so as to predict their parasitic behavior at Microwave and RF For the first time, a whole series of novel coplanar package adapters for multi-conductor transmission line characterization is designed. In this thesis, a systematic approach of on-wafer characterization of a TSSOP package is demonstrated. This method is verified by extracting the lumped element model and transmission line model of the package Leads, numerically and experimentally.
Appears in Collections:Master's Theses (Open)

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