Microwave device characterization

Abstract

The emerging applications of wireless communications call for an effective low-cost approach to the microwave and RF packaging so as to meet the demand of the commercial market place. To ensure a good package design, development of characterization techniques for surface mounted package is thus necessary so as to predict their parasitic behavior at Microwave and RF For the first time, a whole series of novel coplanar package adapters for multi-conductor transmission line characterization is designed. In this thesis, a systematic approach of on-wafer characterization of a TSSOP package is demonstrated. This method is verified by extracting the lumped element model and transmission line model of the package Leads, numerically and experimentally.