Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/134991
Title: HEAT TRANSPORT BY PHONONS AND ELECTRONS ACROSS GRAPHENE INTERFACES AND GRAPHENE-BASED NANOSTRUCTURES
Authors: HUANG BIN
Keywords: Graphene, nanoscale heat transfer, interfaces, phonons, time-domain thermoreflectance
Issue Date: 15-Aug-2016
Citation: HUANG BIN (2016-08-15). HEAT TRANSPORT BY PHONONS AND ELECTRONS ACROSS GRAPHENE INTERFACES AND GRAPHENE-BASED NANOSTRUCTURES. ScholarBank@NUS Repository.
Abstract: Due to high in-plane thermal conductivity of graphene, heat dissipation in graphene devices is primarily governed by the thermal resistance of metal/graphene interface. First, we compared the thermal conductance (<I>G</I>) of Al/trG/Cu and Al/grG/Cu to investigation which of the following factors: roughness, residues, oxides, conformity and voids could reduce the <I>G</I> of graphene interfaces. Second, we measured the <I>G</I> of Al/trG/Cu, Al/grG/Cu, Au/trG/Au, Ag/trG/Ag, and Pd/trG/Pd, and demonstrated that electrons do not play a crucial role in heat transfer across graphene interfaces, regardless of whether the metals are physisorbed or chemisorbed. We also demonstrate a convenient approach to enhance electronic heat transfer across metal/graphene interfaces by depositing the top Pd layer of Pd/trG/Pd interfaces using rf magnetron sputtering. Finally, we prepared metal/graphene heterostructures with the ratio of phononic and electronic thermal conductivity Λ<SUB>ph</SUB> / Λ<SUB>e</SUB> ≈1 at room temperature, despite the ultralow thermal conductivity of ≈0.1 W m<SUP>-1</SUP> K<SUP>-1</SUP>.
URI: http://scholarbank.nus.edu.sg/handle/10635/134991
Appears in Collections:Ph.D Theses (Open)

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