Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/13482
Title: Micromachining of silicon using ion beams and electrochemical etching
Authors: TAVERNIER EMMANUEL PIERRE
Keywords: Silicon micromachining, ion beam, porous silicon, multi-level structures, silicon needles, high aspect-ratio
Issue Date: 12-Nov-2003
Source: TAVERNIER EMMANUEL PIERRE (2003-11-12). Micromachining of silicon using ion beams and electrochemical etching. ScholarBank@NUS Repository.
Abstract: Numerous silicon micromachining methods are available, none of them leading to multi-level structures in one single process. A micromachining process enabling multi-level structures and high aspect ratio needles is studied here.Ion beam irradiation of a silicon sample is combined with Porous Silicon formation. The irradiation of protons or helium ions induces damage in the sample crystal proportionaly to the irradiation dose. These defects will alter the process of electro-chemical etching, leaving a shallower layer of Porous Silicon where the sample underwent irradiation. This part will then stand up once porous silicon is removed.The dose dependency allows local variations of height in the structures. In one single irradiation, multi-level structures are created. Undercut and free standing structures are accessible once the etching reaches the beam end of range. High aspect-ratio structures like silicon pillars arrays have been achieved, opening the way to photonic crystal applications.
URI: http://scholarbank.nus.edu.sg/handle/10635/13482
Appears in Collections:Master's Theses (Open)

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8_References.pdf12.89 kBAdobe PDF

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