Please use this identifier to cite or link to this item: https://doi.org/10.1002/9780470950012.ch11
Title: Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging
Authors: Tan, V.B.C. 
Ong, K.C.
Lim, C.T. 
Field, J.E.
Keywords: "small" and "green"-motivations for research into dynamic mechanical properties
Dynamic material properties-of solder specimens
Dynamic mechanical properties and microstructural studies-lead-free solders in electronic packaging
Specimen preparation-revealing bulk solder and solder ball microstructure
Young's modulus of solder specimens
Issue Date: 7-Apr-2011
Citation: Tan, V.B.C.,Ong, K.C.,Lim, C.T.,Field, J.E. (2011-04-07). Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging. Structural Dynamics of Electronic and Photonic Systems : 255-276. ScholarBank@NUS Repository. https://doi.org/10.1002/9780470950012.ch11
Source Title: Structural Dynamics of Electronic and Photonic Systems
URI: http://scholarbank.nus.edu.sg/handle/10635/125123
ISBN: 9780470250020
DOI: 10.1002/9780470950012.ch11
Appears in Collections:Staff Publications

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