Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging

Please use this identifier to cite or link to this item: https://doi.org/10.1002/9780470950012.ch11

Title:	Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging
Authors:	Tan, V.B.C. Ong, K.C. Lim, C.T. Field, J.E.
Keywords:	"small" and "green"-motivations for research into dynamic mechanical properties Dynamic material properties-of solder specimens Dynamic mechanical properties and microstructural studies-lead-free solders in electronic packaging Specimen preparation-revealing bulk solder and solder ball microstructure Young's modulus of solder specimens
Issue Date:	7-Apr-2011
Citation:	Tan, V.B.C.,Ong, K.C.,Lim, C.T.,Field, J.E. (2011-04-07). Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging. Structural Dynamics of Electronic and Photonic Systems : 255-276. ScholarBank@NUS Repository. https://doi.org/10.1002/9780470950012.ch11
Source Title:	Structural Dynamics of Electronic and Photonic Systems
URI:	http://scholarbank.nus.edu.sg/handle/10635/125123
ISBN:	9780470250020
DOI:	10.1002/9780470950012.ch11
Appears in Collections:	Staff Publications

There are no files associated with this item.

Check