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|Title:||Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging|
|Authors:||Tan, V.B.C. |
|Keywords:||"small" and "green"-motivations for research into dynamic mechanical properties|
Dynamic material properties-of solder specimens
Dynamic mechanical properties and microstructural studies-lead-free solders in electronic packaging
Specimen preparation-revealing bulk solder and solder ball microstructure
Young's modulus of solder specimens
|Source:||Tan, V.B.C.,Ong, K.C.,Lim, C.T.,Field, J.E. (2011-04-07). Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging. Structural Dynamics of Electronic and Photonic Systems : 255-276. ScholarBank@NUS Repository. https://doi.org/10.1002/9780470950012.ch11|
|Source Title:||Structural Dynamics of Electronic and Photonic Systems|
|Appears in Collections:||Staff Publications|
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