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|Title:||FIB precision TEM sample preparation using carbon replica|
|Authors:||Sheng, T.T. |
Wang, John L.F.
Cheng, Jeng Kou
|Citation:||Sheng, T.T.,Goh, G.P.,Tung, C.H.,Wang, John L.F.,Cheng, Jeng Kou (1997). FIB precision TEM sample preparation using carbon replica. Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA : 92-96. ScholarBank@NUS Repository.|
|Abstract:||A new precision transmission electron microscopy (XTEM) sample preparation method was developed and reported here. No mechanical polishing and grinding are needed. The main difference of this method over conventional method using focused ion beam (FIB) is that the sample sectioned with FIB can be extracted directly from the wafer site and transferred to a holy carbon supporting film for TEM examination. With this technique, a cross section TEM sample can be prepared easily and quickly, thus enhancing both productivity and turnaround time.|
|Source Title:||Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA|
|Appears in Collections:||Staff Publications|
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