Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/112963
Title: Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope
Authors: Lu, J.
Trigg, A.
Wu, J. 
Chai, T.
Issue Date: Sep-1998
Citation: Lu, J.,Trigg, A.,Wu, J.,Chai, T. (1998-09). Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope. International Journal of Microcircuits and Electronic Packaging 21 (3) : 231-236. ScholarBank@NUS Repository.
Abstract: Infrared Microscopy (IRM) inspection of underfill delamination and cracks in Flip Chip board (FCOB) assemblies is reported in this work. The location and extent of chip/underfill delamination has been determined. Internal cracks in underfill can also be detected by IRM. Compared to scanning acoustic microscopy (SAM), IRM technique provides higher resolution images of underfill related failures and eliminates the `edge effect' which occurs in SAM. Underfill failures detected by IRM have been verified by destructive physical analysis, microscopy, and scanning electronic microscopy (SEM).
Source Title: International Journal of Microcircuits and Electronic Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/112963
ISSN: 10631674
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

66
checked on Sep 21, 2018

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.