Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/111552
Title: Cure of underfills in flip chips using microwave
Authors: Yi, S.
Liu, L. 
Park, S.K.
Issue Date: 2004
Citation: Yi, S.,Liu, L.,Park, S.K. (2004). Cure of underfills in flip chips using microwave. 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 92-98. ScholarBank@NUS Repository.
Abstract: Underfill materials cured thermally as well as by microwave have been studied. The underfill material composed of cycloaliphatic epoxy and anhydride is studied in this paper. Thermo-mechanical properties of the underfill have been evaluated using a thermo-mechanical analyzer (TMA), a thermal gravimetric analyzer (TGA), and a dynamic mechanical analyzer (DMA). The experimental results show that the cure kinetics and mechanical properties of the underfill material are not changed by energy sources. Moreover, a three dimensional finite element method was developed to simulate curing of underfills using microwave. The present numerical results show that the position of the substrate can affect natural frequencies and field distributions significantly. © 2004 IEEE.
Source Title: 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
URI: http://scholarbank.nus.edu.sg/handle/10635/111552
ISBN: 0780387449
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

33
checked on Nov 16, 2018

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.