Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process

Please use this identifier to cite or link to this item: https://doi.org/10.1088/0268-1242/17/9/302

Title:	Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process
Authors:	Lu, H. Kang, C.L. Wong, S.C.K. Gong, H.
Issue Date:	Sep-2002
Citation:	Lu, H., Kang, C.L., Wong, S.C.K., Gong, H. (2002-09). Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process. Semiconductor Science and Technology 17 (9) : 911-917. ScholarBank@NUS Repository. https://doi.org/10.1088/0268-1242/17/9/302
Abstract:	Several commercial electroless nickel chemicals were evaluated with a low cost wafer bumping process. In this paper we describe some physical and electric properties of the nickel bumps built up by these commercial electroless nickel chemicals. Finally, a commercial chemical was suggested for the low cost wafer bumping process.
Source Title:	Semiconductor Science and Technology
URI:	http://scholarbank.nus.edu.sg/handle/10635/107031
ISSN:	02681242
DOI:	10.1088/0268-1242/17/9/302
Appears in Collections:	Staff Publications

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