Please use this identifier to cite or link to this item:
|Title:||Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process|
|Source:||Lu, H.,Kang, C.L.,Wong, S.C.K.,Gong, H. (2002-09). Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process. Semiconductor Science and Technology 17 (9) : 911-917. ScholarBank@NUS Repository. https://doi.org/9/302|
|Abstract:||Several commercial electroless nickel chemicals were evaluated with a low cost wafer bumping process. In this paper we describe some physical and electric properties of the nickel bumps built up by these commercial electroless nickel chemicals. Finally, a commercial chemical was suggested for the low cost wafer bumping process.|
|Source Title:||Semiconductor Science and Technology|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jan 13, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.