Please use this identifier to cite or link to this item:
https://doi.org/10.1016/j.mee.2012.05.003
DC Field | Value | |
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dc.title | Resist evaluation for Ni mold fabrication and proton beam writing | |
dc.contributor.author | Wang, Y.H. | |
dc.contributor.author | Malar, P. | |
dc.contributor.author | Zhao, J. | |
dc.contributor.author | Van Kan, J.A. | |
dc.date.accessioned | 2014-10-16T09:52:24Z | |
dc.date.available | 2014-10-16T09:52:24Z | |
dc.date.issued | 2013-02 | |
dc.identifier.citation | Wang, Y.H., Malar, P., Zhao, J., Van Kan, J.A. (2013-02). Resist evaluation for Ni mold fabrication and proton beam writing. Microelectronic Engineering 102 : 40-43. ScholarBank@NUS Repository. https://doi.org/10.1016/j.mee.2012.05.003 | |
dc.identifier.issn | 01679317 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/98868 | |
dc.description.abstract | In our experiments, we use different photoresists for proton beam writing and mold fabrication. We have fabricated Ni mold with structures down to 500 nm. We first use a fine focused proton beam to expose different photoresists, Polymethyl Methacrylate (PMMA), AR-P 3250 and ma-N 2410. After development and nickel sulfamate electroplating, the structures were faithfully transferred from the photoresists to Ni molds. © 2011 Elsevier B.V. All rights reserved. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.mee.2012.05.003 | |
dc.source | Scopus | |
dc.subject | AR-P 3250 | |
dc.subject | Electroplating | |
dc.subject | ma-N 2410 | |
dc.subject | PMMA | |
dc.subject | Proton beam writing (PBW) | |
dc.type | Conference Paper | |
dc.contributor.department | PHYSICS | |
dc.description.doi | 10.1016/j.mee.2012.05.003 | |
dc.description.sourcetitle | Microelectronic Engineering | |
dc.description.volume | 102 | |
dc.description.page | 40-43 | |
dc.description.coden | MIENE | |
dc.identifier.isiut | 000312232300012 | |
Appears in Collections: | Staff Publications |
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