Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.mee.2012.05.003
DC FieldValue
dc.titleResist evaluation for Ni mold fabrication and proton beam writing
dc.contributor.authorWang, Y.H.
dc.contributor.authorMalar, P.
dc.contributor.authorZhao, J.
dc.contributor.authorVan Kan, J.A.
dc.date.accessioned2014-10-16T09:52:24Z
dc.date.available2014-10-16T09:52:24Z
dc.date.issued2013-02
dc.identifier.citationWang, Y.H., Malar, P., Zhao, J., Van Kan, J.A. (2013-02). Resist evaluation for Ni mold fabrication and proton beam writing. Microelectronic Engineering 102 : 40-43. ScholarBank@NUS Repository. https://doi.org/10.1016/j.mee.2012.05.003
dc.identifier.issn01679317
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/98868
dc.description.abstractIn our experiments, we use different photoresists for proton beam writing and mold fabrication. We have fabricated Ni mold with structures down to 500 nm. We first use a fine focused proton beam to expose different photoresists, Polymethyl Methacrylate (PMMA), AR-P 3250 and ma-N 2410. After development and nickel sulfamate electroplating, the structures were faithfully transferred from the photoresists to Ni molds. © 2011 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.mee.2012.05.003
dc.sourceScopus
dc.subjectAR-P 3250
dc.subjectElectroplating
dc.subjectma-N 2410
dc.subjectPMMA
dc.subjectProton beam writing (PBW)
dc.typeConference Paper
dc.contributor.departmentPHYSICS
dc.description.doi10.1016/j.mee.2012.05.003
dc.description.sourcetitleMicroelectronic Engineering
dc.description.volume102
dc.description.page40-43
dc.description.codenMIENE
dc.identifier.isiut000312232300012
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