Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.436674
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dc.titleMicromachining using a focused MeV proton beam for the production of high precision 3D microstructures with vertical sidewalls of high orthogonality
dc.contributor.authorVan Kan, J.A.
dc.contributor.authorBettiol, A.A.
dc.contributor.authorAnsari, K.
dc.contributor.authorWatt, F.
dc.date.accessioned2014-10-16T09:51:33Z
dc.date.available2014-10-16T09:51:33Z
dc.date.issued2001
dc.identifier.citationVan Kan, J.A., Bettiol, A.A., Ansari, K., Watt, F. (2001). Micromachining using a focused MeV proton beam for the production of high precision 3D microstructures with vertical sidewalls of high orthogonality. Proceedings of SPIE - The International Society for Optical Engineering 4343 : 466-472. ScholarBank@NUS Repository. https://doi.org/10.1117/12.436674
dc.identifier.issn0277786X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/98796
dc.description.abstractThe production of high aspect ratio microstructures requires a lithographic technique capable of producing microstructures with vertical sidewalls. There are few techniques (eg proton beam micromachining, LIGA and Stereolithoghaphy) capable of producing high aspect ratio microstructures at sub-micron dimensions. In Proton Beam Micromachining (PBM), a high energy (eg 2 MeV) proton beam is focused to a sub-micron spot size and scanned over a resist material (eg SU-8 and PMMA). When a proton beam interacts with matter it follows an almost straight path, the depth of which is dependent on the proton beam energy. These features enable the production of multilevel microstructures with vertical sidewalls of high orthogonality. Proton beam micromachining is a fast direct write lithographic technique; in a few seconds a complicated pattern in an area of 400 × 400 μm2 can be exposed down to a depth of 150 μm. These-features make proton beam micromachining a technique of high potential for the production of high-aspect-ratio-structures at a much lower total cost than the LIGA process, which requires a synchrotron radiation source and precision masks. Research is currently under way to improve the process that employs the SU-8 negative photo-resist as a mold to electroplate Ni. Experiments have shown that post-bake and curing steps are not required in this SU-8 process, reducing the effects of cracking and internal stress in the resist. Plated Ni structures can be easily produced which are high quality negative copies of the SU-8 produced microstructures.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1117/12.436674
dc.sourceScopus
dc.subject3D microstructures
dc.subjectElectroplating
dc.subjectHigh aspect ratio
dc.subjectMicromachining
dc.subjectNuclear microscope
dc.subjectProton beam
dc.typeConference Paper
dc.contributor.departmentPHYSICS
dc.description.doi10.1117/12.436674
dc.description.sourcetitleProceedings of SPIE - The International Society for Optical Engineering
dc.description.volume4343
dc.description.page466-472
dc.description.codenPSISD
dc.identifier.isiut000172675100049
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