Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.mee.2012.05.020
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dc.titleFabrication of nickel molds using proton beam writing for micro/nano fluidic devices
dc.contributor.authorLiu, F.
dc.contributor.authorTan, K.B.
dc.contributor.authorMalar, P.
dc.contributor.authorBikkarolla, S.K.
dc.contributor.authorVan Kan, J.A.
dc.date.accessioned2014-10-16T09:50:26Z
dc.date.available2014-10-16T09:50:26Z
dc.date.issued2013-02
dc.identifier.citationLiu, F., Tan, K.B., Malar, P., Bikkarolla, S.K., Van Kan, J.A. (2013-02). Fabrication of nickel molds using proton beam writing for micro/nano fluidic devices. Microelectronic Engineering 102 : 36-39. ScholarBank@NUS Repository. https://doi.org/10.1016/j.mee.2012.05.020
dc.identifier.issn01679317
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/98707
dc.description.abstractIn this paper, we present the fabrication of micro/nano fluidic devices with the combination of proton beam writing and UV lithography. Proton beam writing was used to generate the fine features with smooth sidewall profiles on ma-N resist, 110 and 600 nm thick. UV lithography is used to fabricate the micron sized feeding channels properly aligned with the nanostructures on ma-P resist. To get a durable mold, we need to transfer the resist structure into a nickel mold. Nickel electroplating and re-electroplating have been carried out to replicate the polymer structure in a nickel mold with the desired geometry, resulting in a durable Ni master mold. Finally it is demonstrated that these Ni molds can be used to make high quality PDMS fluidic channels used for DNA lab on chip experiments. © 2011 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.mee.2012.05.020
dc.sourceScopus
dc.subjectDNA analysis
dc.subjectNickel molds
dc.subjectProton beam writing
dc.typeConference Paper
dc.contributor.departmentPHYSICS
dc.description.doi10.1016/j.mee.2012.05.020
dc.description.sourcetitleMicroelectronic Engineering
dc.description.volume102
dc.description.page36-39
dc.description.codenMIENE
dc.identifier.isiut000312232300011
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