Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/96684
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dc.titleFT-IR study of the imidization process of photosensitive polyimide PMDA/ODA
dc.contributor.authorLi, W.S.
dc.contributor.authorShen, Z.X.
dc.contributor.authorZheng, J.Z.
dc.contributor.authorTang, S.H.
dc.date.accessioned2014-10-16T09:26:20Z
dc.date.available2014-10-16T09:26:20Z
dc.date.issued1998-07
dc.identifier.citationLi, W.S.,Shen, Z.X.,Zheng, J.Z.,Tang, S.H. (1998-07). FT-IR study of the imidization process of photosensitive polyimide PMDA/ODA. Applied Spectroscopy 52 (7) : 985-989. ScholarBank@NUS Repository.
dc.identifier.issn00037028
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/96684
dc.description.abstractFourier transform infrared spectroscopy (FT-IR) was used to study the cure reaction process of an ester-type photosensitive polyimide, PMDA/ODA films coated on silicon wafer substrates. In the in situ high-temperature FT-IR study carried out in vacuum, all the characteristic peaks of imide and the crosslinkable group were observed to decrease gradually with an increase in temperature. The completion of the imidization reaction is at ∼270 °C. Our result shows that the ester-type photosensitive polyimide can be cured at a much lower temperature than previously reported. The imide peak δas(C, C > NC) at 588 cm-1 was used to follow the imidization process, and the result agrees well with that obtained by using another imide peak v(C-N-C) at 1378 cm-1. The film shrinks by one third during the cure process, and the temperature dependence of the film thickness shows excellent agreement with the "imidization degree".
dc.sourceScopus
dc.subjectCuring reaction process
dc.subjectFourier transform infrared spectroscopy (FT-IR)
dc.subjectImidization degree
dc.subjectPolyimide
dc.typeArticle
dc.contributor.departmentPHYSICS
dc.description.sourcetitleApplied Spectroscopy
dc.description.volume52
dc.description.issue7
dc.description.page985-989
dc.description.codenAPSPA
dc.identifier.isiutNOT_IN_WOS
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