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|Title:||Characterization of a low-k organic spin-on-glass as an intermetal dielectric||Authors:||Wang, C.Y.
|Issue Date:||1999||Citation:||Wang, C.Y.,Zheng, J.Z.,Shen, Z.X.,Xu, Y.,Lim, S.L.,Liu, R.,Huan, A.C.H. (1999). Characterization of a low-k organic spin-on-glass as an intermetal dielectric. Surface and Interface Analysis 28 (1) : 97-100. ScholarBank@NUS Repository. https://doi.org/10.1002/(SICI)1096-9918(199908)28:13.0.CO;2-M||Abstract:||In this paper, we used Fourier transform infrared spectroscopy (FTIR) to study the curing process and thermal stability of a low-k organic SOG (spin-on glass), methyl silsesquioxane (MSQ). The solvent was completely driven out and the MSQ had a high degree of cross-linking after baking. Curing at a higher temperature causes further cross-linking. We also studied the effect of additional treatment processes, such as electron beam and ion implantation, in order to increase the resistance of the MSQ to oxygen plasma ashing. The FTIR spectra and SIMS data of these treated samples before and after oxygen plasma ashing are presented. We also measured the refractive indices and the thicknesses of the samples before and after the electron beam/ion treatment to study the properties of the films.||Source Title:||Surface and Interface Analysis||URI:||http://scholarbank.nus.edu.sg/handle/10635/95955||ISSN:||01422421||DOI:||10.1002/(SICI)1096-9918(199908)28:13.0.CO;2-M|
|Appears in Collections:||Staff Publications|
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