Additive strategy for metal incorporation into polyimides

Abstract

An outline is presented of a strategy in the choice of additives for incorporation into polyimides based on a more thorough consideration of the criteria that a potential dopant should possess. It is shown that in all instances where the additives meet the solvent and thermal decomposition requirements, good polymer films with reasonable thermal stability have been produced and suggests that they are useful criteria in dopant selection. Polyimide films using 5 new dopants have been synthesized at several polymer:metal ratios. Thermal, spectral, elemental and electrical characterizations have been performed. All dopants appear to be compatible additives which display lowering of electrical resistivities comparable or better than CoCl2 doped polyimides.