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https://doi.org/10.1163/156856101750430459
Title: | Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper | Authors: | Yang, G.H. Kang, E.T. Neoh, K.G. |
Keywords: | Adhesion Copper Electroless plating Glycidyl methacrylate Plasma polymerization PTFE UV-induced graft copolymerization |
Issue Date: | 2001 | Citation: | Yang, G.H., Kang, E.T., Neoh, K.G. (2001). Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper. Journal of Adhesion Science and Technology 15 (6) : 727-746. ScholarBank@NUS Repository. https://doi.org/10.1163/156856101750430459 | Abstract: | Surface modification of H2 plasma-pretreated poly(tetrafluoroethylene) (PTFE) films, either by plasma polymerization and deposition of GMA, or by UV-induced graft copolymerization with glycidyl methacrylate (GMA), was carried out for adhesion enhancement with the electrolessly-deposited copper. XPS and FTIR results revealed that the epoxide groups in the plasma-polymerized GMA (pp-GMA) layer had been preserved to various extents, depending on the glow discharge conditions. The T-peel adhesion test results showed that the adhesion strengths of the electrolessly-deposited copper on both the pp-GMA modified PTFE (pp-GMA-PTFE) film and the GMA graft-copolymerized PTFE (GMA-g-PTFE) film were much higher than that of the electrolessly-deposited copper on the pristine or the H2 plasma-treated PTFE film. The high adhesion strength between the electrolessly-deposited copper and the surface-modified PTFE film was attributed to the fact that the plasma-polymerized and the UV graft-copolymerized GMA chains were covalently tethered on the H2 plasma-pretreated PTFE surface, as well as the fact that these GMA chains were spatially and interactively distributed into the copper matrix. | Source Title: | Journal of Adhesion Science and Technology | URI: | http://scholarbank.nus.edu.sg/handle/10635/92373 | ISSN: | 01694243 | DOI: | 10.1163/156856101750430459 |
Appears in Collections: | Staff Publications |
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