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Please use this identifier to cite or link to this item: https://doi.org/10.1116/1.1388620
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dc.titleElectroless plating of copper on poly(tetrafluoroethylene) films modified by NH3 plasma and surface graft copolymerization with aniline
dc.contributor.authorMa, Z.H.
dc.contributor.authorTan, K.L.
dc.contributor.authorAlian, A.D.
dc.contributor.authorKang, E.T.
dc.contributor.authorNeoh, K.G.
dc.date.accessioned2014-10-09T09:53:14Z
dc.date.available2014-10-09T09:53:14Z
dc.date.issued2001-09
dc.identifier.citationMa, Z.H., Tan, K.L., Alian, A.D., Kang, E.T., Neoh, K.G. (2001-09). Electroless plating of copper on poly(tetrafluoroethylene) films modified by NH3 plasma and surface graft copolymerization with aniline. Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films 19 (5) : 2471-2478. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1388620
dc.identifier.issn07342101
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/91963
dc.description.abstractThe electroless plating of copper on Poly(tetrafluoroethylene) (PTFE) films modified by ammonia plasma and surface graft copolymerization with aniline was reported. The each stage of surface modification, surface activation and electroless deposition processes were investigated to study the composition and chemical states of the PTFE using x-ray photoelectron spectroscopy (XPS). The adhesion strength was found to be dependent on the graft concentration, and it was due to the synergistic effects of strong interaction between the grafted aniline polymer and the metal atoms including the spatial distribution of metal matrix and the covalent tether of graft chains on the PTFE surface.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1116/1.1388620
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentCHEMICAL & ENVIRONMENTAL ENGINEERING
dc.contributor.departmentPHYSICS
dc.description.doi10.1116/1.1388620
dc.description.sourcetitleJournal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films
dc.description.volume19
dc.description.issue5
dc.description.page2471-2478
dc.description.codenJVTAD
dc.identifier.isiut000171376700065
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