Please use this identifier to cite or link to this item: https://doi.org/10.1007/BF00357824
DC FieldValue
dc.titleReactive deposition of ultrafine cobalt powders - Part I Electrochemical investigation
dc.contributor.authorCui, C.Q.
dc.contributor.authorTseung, A.C.C.
dc.date.accessioned2014-10-09T08:20:49Z
dc.date.available2014-10-09T08:20:49Z
dc.date.issued1993-01
dc.identifier.citationCui, C.Q., Tseung, A.C.C. (1993-01). Reactive deposition of ultrafine cobalt powders - Part I Electrochemical investigation. Journal of Materials Science 28 (2) : 461-468. ScholarBank@NUS Repository. https://doi.org/10.1007/BF00357824
dc.identifier.issn00222461
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/91668
dc.description.abstractDuring the reactive deposition of cobalt powders, Co(OH)2 colloidal layers are formed at the electrode surface; the individual cobalt crystals are isolated by the Co(OH)2 colloid around the grain boundaries so that their growth is inhibited and ultrafine cobalt crystal grains are formed, which are loosely attached to the titanium substrate. The existence of Co(OH)2 colloid layer at the electrode surface depresses the hydrogen evolution reaction in the deposition process and accelerates the decrease of the interfacial Co2+ concentration. Therefore, compared to the normal deposition of cobalt powders, it has several unique advantages: (1) ultrafine cobalt powders (0.4-0.6 μm) can be produced; (2) the amount of Co(OH)2 in the powders is decreased; (3) there is a wider range of current density for the formation of cobalt powders. © 1993 Chapman & Hall.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1007/BF00357824
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentCHEMICAL ENGINEERING
dc.description.doi10.1007/BF00357824
dc.description.sourcetitleJournal of Materials Science
dc.description.volume28
dc.description.issue2
dc.description.page461-468
dc.description.codenJMTSA
dc.identifier.isiutA1993KM82300026
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