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Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.colsurfa.2004.05.029
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dc.titleUltra thin films of oligoimide through molecular assembly
dc.contributor.authorZhang, F.
dc.contributor.authorSrinivasan, M.P.
dc.date.accessioned2014-10-09T07:08:48Z
dc.date.available2014-10-09T07:08:48Z
dc.date.issued2005-05-05
dc.identifier.citationZhang, F., Srinivasan, M.P. (2005-05-05). Ultra thin films of oligoimide through molecular assembly. Colloids and Surfaces A: Physicochemical and Engineering Aspects 257-258 : 295-299. ScholarBank@NUS Repository. https://doi.org/10.1016/j.colsurfa.2004.05.029
dc.identifier.issn09277757
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/90758
dc.description.abstractUltra thin oligoimide films are prepared through molecular assembly of monomers. Pyromellitic dianhydride (PMDA) and diaminodiphenylether (DDE) are assembled sequentially from their solutions on to Si substrates surface-modified with p-aminophenyltrimethoxysilane (APhS). X-ray photoelectron spectroscopy analysis shows that the PMDA/DDE interfacial reaction is complete. UV absorption confirms a linear growth of the film with the number of deposition steps. Atomic force microscopy exhibits a good morphological uniformity in the film with a surface roughness of less than 0.5 nm at each deposition. © 2004 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.colsurfa.2004.05.029
dc.sourceScopus
dc.subjectInterfacial reaction
dc.subjectMolecular assembly
dc.subjectOligoimide
dc.subjectUltra thin film
dc.subjectUniform morphology
dc.typeConference Paper
dc.contributor.departmentCHEMICAL & BIOMOLECULAR ENGINEERING
dc.description.doi10.1016/j.colsurfa.2004.05.029
dc.description.sourcetitleColloids and Surfaces A: Physicochemical and Engineering Aspects
dc.description.volume257-258
dc.description.page295-299
dc.description.codenCPEAE
dc.identifier.isiut000228321500056
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